- Resolution identifies refined defects comparable to wire sag, close to shorts, and stray wires for complete evaluation of wire bond integrity
- Superior capacitive-based check methodology allows superior defect detection
- Take a look at platform is excessive quantity manufacturing prepared, able to testing 20 built-in circuits concurrently for throughput of as much as 72,000 items per hour
INDIA – Keysight Applied sciences, Inc. introduces the Electrical Structural Tester (EST), a wire bond inspection answer for semiconductor manufacturing that ensures the integrity and reliability of digital elements.
The semiconductor trade is confronted with testing challenges as a result of growing density of chips in mission-critical functions comparable to medical gadgets and automotive techniques. Present testing methodologies typically fall quick in detecting wire bond structural defects, which result in expensive latent failures. As well as, conventional testing approaches continuously depend on sampling strategies that don’t adequately establish wire bond structural defects.
The EST addresses these testing challenges by utilizing cutting-edge nano Vectorless Take a look at Enhanced Efficiency (nVTEP) know-how to create a capacitive construction between the wire bond and a sensor plate. Utilizing this technique the EST can establish refined defects comparable to wire sag, close to shorts, and stray wires to allow complete evaluation of wire bond integrity.
Key advantages of the EST embody:
- Superior defect detection – Identifies a variety of wire bond defects, each electrical and non-electrical, by analyzing adjustments in capacitive coupling patterns to make sure the performance and reliability of digital elements.
- Excessive quantity manufacturing prepared – Permits throughput of as much as 72,000 items per hour by means of the flexibility to check as much as 20 built-in circuits concurrently, which boosts productiveness and effectivity in high-volume manufacturing environments.
- Large knowledge analytics integration: Captures defects and enhances yield by means of superior strategies like marginal retry check (MaRT), dynamic half averaging check (DPAT), and real-time half averaging check (RPAT).
Carol Leh, Vice President, Digital Industrial Options Group Middle of Excellence, Keysight, stated: “Keysight is devoted to pioneering progressive options that tackle essentially the most urgent challenges within the wire bonding course of. The Electrical Structural Tester empowers chip producers to boost manufacturing effectivity by quickly figuring out wire bond defects, guaranteeing superior high quality and reliability in high-volume manufacturing.”
