Faraday has unveiled a complicated packaging service that simplifies chiplet integration by coordinating numerous distributors and chiplet sources. The platform provides three core companies—design, packaging, and manufacturing—to enhance the effectivity of assembling advanced semiconductor designs.
Within the chiplet period, superior packaging capability is more and more constrained. Faraday’s platform tackles this problem by coordinating distributors for chiplets, excessive bandwidth reminiscence (HBM), interposers, and a couple of.5D/3D packaging. It gives a one-stop answer with companies together with chiplet design, testing, manufacturing planning, procurement, stock administration, and superior packaging. Tailor-made to numerous consumer wants, the platform ensures a dependable provide of vital elements.
As well as, Faraday makes a speciality of designing and implementing key chiplets, comparable to I/O dies, SoC/compute dies, and interposers. The corporate companions with UMC, Samsung, Intel, and OSAT suppliers to ship superior packaging options. These embody system-level design, energy and sign integrity evaluation, and thermal dissipation optimization for applied sciences like Intel’s EMIB, Samsung’s I-Dice, and a couple of.5D packaging.
Faraday Expertise is an ASIC design service and IP supplier, licensed to ISO 9001 for high quality administration and ISO 26262 for useful security in automotive programs. Its silicon IP portfolio contains I/O, reminiscence, ARM-compliant CPUs, and high-speed interfaces like USB, Ethernet, SATA, PCIe, and SerDes.
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