Samsung has began offering extra particulars about its bottom energy supply community (BSPDN) roadmap, stating that its 2-nm course of node will probably be optimized for this new expertise when it enters mass manufacturing in 2027.
Whereas commerce media has been recurrently reporting on the supply of BSPDN expertise from giant fabs—Intel, Samsung, and TSMC—in accordance with TrendForce, it’s the primary time a senior Samsung Foundry govt has offered particulars concerning the firm’s BSPDN roadmap.
Supply: Samsung
In a report revealed in Korea Financial Day by day, Lee Sung-Jae, VP of PDK improvement crew at Samsung, mentioned that BSPDN will scale back the dimensions of Samsung’s 2 nm chip by 17% in comparison with the standard front-end energy supply. He added that BSPDN will permit Samsung to enhance 2-nm chip’s efficiency and energy effectivity by 8% and 15%, respectively.
In line with an Intel examine, energy strains usually occupy round 20% of the area on the chip floor in a conventional front-end energy supply. The BSPDN expertise places the facility rails on the again of the wafer to take away bottlenecks between energy and sign strains, making the manufacturing of smaller chips simpler.
Furthermore, bottom energy supply facilitates thicker, lower-resistance wires, thus delivering extra energy to allow greater efficiency and save energy. In line with a Samsung paper offered on the VLSI Symposium in 2023, BSPDN additionally facilitates a 9.2% discount in wiring size.
In that paper, Samsung additionally claimed to have applied bottom energy supply in two Arm-based take a look at chips, reaching a ten% and 19% die space discount. The corporate didn’t disclose the method node for these take a look at chips.
It’s price noting that after being a pioneer in deploying gate-all-around (GAA) manufacturing expertise in its 3-nm chips, Samsung is now following Intel and TSMC in implementing the BSPDN approach.
Intel, which calls its bottom energy supply expertise PowerVia, is anticipated to supply chips primarily based on this system this yr. Subsequent, TSMC is planning to combine its bottom energy supply expertise—Tremendous PowerRail structure—in its 1.6 chips to be mass-produced in 2026.
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The publish Samsung’s bottom energy supply community (BSPDN) roadmap appeared first on EDN.
